Department Head & Associate Professor

Department of Industrial Engineering & Technology
Texas A&M University – Commerce
P.O. Box 3011, Commerce, TX 75429-3011
Phone: 903-886-5474
Fax: 903-886-5960
Email: brent_donham@tamu-commerce.edu

Education:
Ed.D. in Educational Administration, Texas A&M University – Commerce, Commerce, Texas
M.S. in Electrical Engineering, Stanford University, Stanford, California
B.S. in Electrical Engineering, New Mexico State University, Las Cruces, New Mexico

Academic/Professional Experience:

• Department Head & Associate Professor, Texas A&M University-Commerce
• Associate Vice President, Richland College
• Senior Engineering Specialist, E-Systems, Inc.
• Member of Technical Staff, Sandia National Laboratories

Professional Service (selected):

• American Society for Engineering Education (ASEE)
• Field of Study for Engineering Technology, Texas Higher Education Coordinating Board
• Nanotechnology Curriculum Consortium, Texas Higher Education Coordinating Board
• Semiconductor Manufacturing Technician Skill Standards Task Force, SEMATECH and SEMI/SEMATECH
• Metroplex Technology Business Council (MTBC), Richardson, Texas
• Workforce Education Course Manual (WECM) Project Facilitator

Publications (selected):

• Donham, B. L. (2009). Articulated Associate in Science Engineering Degree. Proceedings American Society for Engineering Education‑Gulf Southwest Conference 2009.
• Donham, B. L. (2006). A comparative analysis of student performance and attitudes in traditional advanced placement courses and advanced placement courses with dual credit overlay. Dissertation Abstracts International, 66(11), 3873A. (UMI No. 3196384)
• Donham, B. (2003, October/November). Maintaining high-tech programs on a low-tech budget. Community College Journal, 74(2), 23-34.
• Gilbert, B., Randall, B., Donham, B., Schwab, D., Benson, D., Tuckerman, D., & Goodwin, W. (1997, February). Implementation of a gallium arsenide multichip digital circuit operating at 500-1000 MHz clock rate using a Si/Cu/SiO2 MCM-D technology. IEEE Transactions on Components, Packaging, and Manufacturing Technology – Part B, 20(1), 17-26.
• Randall, B., Schwab, D., Donham, B., Tuckerman, D., Benson, D., Jsu, R., Brathwaite, N., Enquist, S., Carr, K., Wendel, S., Seawright, K., Goodwin, W., & Gilbert, B. (1993, September). GaAs digital MCM in Si/Cu/SiO2 technology for clock rates up to 1 GHz. Proceedings International Electronics Packaging Conference, San Diego, California, 1, 615-627.

Paper Presentations (selected):

• “Articulated Associate in Science Engineering Degree”, American Society for Engineering Education-Gulf Southwest Conference.
• “The Telecom Corridor Alliance”, Texas Engineering and Technical Consortium (TETC) Best Practices Conference.
• "Student Performance in Advanced Placement Courses with Dual Credit Overlay”, National Council of Professors of Educational Administration Conference.
• “A Comparative Analysis of Student Performance and Attitudes in Traditional Advanced Placement Courses and Advanced Placement Courses with Dual Credit Overlay”, Southwest Educational Research Association 29th Annual Meeting.
• “TechKNOW-Ed, A Joint Partnership Between Education and Industry”, NISOD International Conference on Teaching and Leadership Excellence.

Honors:

• Recipient, “Morphet Dissertation Award”, National Council of Professors of Educational Administration.
• Recipient, “Tech Titan of the Future Award”, Metroplex Technology Business Council, Articulated Engineering program.
• Recipient, “President’s Award for Excellence”, Texas Association of College Technical Educators, TechKNOW-Ed program.
• Recipient, “Innovation of the Year Award”, Richland College
• Recipient, “Top 100 Award for Technical Achievement”, E-Systems